Spherical silica powder is a kind of spherical silica powder material with small specific surface area, good fluidity and low stress, which is made from selected irregular angular silica powder as raw material and processed into a sphere by flame melting method.
Large scale integrated circuit packaging, printed circuit board, electronic adhesive;
Others include 3D printing, special rubber for aerospace, etc.
Application of spherical silica powder in CCL industry
The development of the CCL industry has a history of more than 100 years. Its development is closely linked with the development of the downstream electronic information industry, and also closely linked with the development of the upstream of the CCL, i.e. the material industry related to the manufacturing of the CCL. There are many materials related to the manufacture of copper clad plate. The three materials often mentioned are resin, copper foil and glass fiber cloth. In recent years, as a component of CCL products, filler has become more and more important, and has become the fourth main material of CCL.
Because of its high electrical insulation, high thermal stability, acid and alkali resistance, wear resistance, etc., spherical silicon powder can be used as functional filler in the copper clad plate, which can significantly improve the mechanical, thermal and electrical properties of the copper clad plate. Through surface treatment or surface modification, the compatibility with epoxy resin can be increased, the binding force of the two can be improved, and the strength of the product can be improved.
Application of spherical silica powder in ceramic industry
As the filler for honeycomb ceramic carrier, high-purity spherical silicon powder has excellent dielectric properties, low coefficient of thermal expansion, good electrical insulation, multi-layer protective layer formed in oxidation, good mechanical properties and high-temperature oxidation resistance, and can also solve the brittleness of ceramics. After adding spherical silicon powder into the ceramic, it is more compact, heat-resistant and cold-fatigue, and its strength is greatly improved.
The special refractory added with spherical silica powder has good fluidity, sinterability, binding property, filling pore performance and so on, which makes the special refractory have the characteristics of dense structure, high strength, wear resistance and corrosion resistance.
Spherical silicon powder has become a basic, important and key raw material in many high-tech fields due to its excellent physical properties, high chemical stability and unique optical properties.
Application of spherical silica powder in adhesive industry
Spherical silicon powder has low linear expansion coefficient, corrosion resistance, good fluidity, excellent electrical performance, mechanical performance, cold and hot impact resistance and other characteristics, and is mainly used for packaging, bonding and protection of various electronic components, sensors, precision modules and other components.
Scope of application
Power capacitor, filter capacitor, AC metallized capacitor, metallized high-voltage lamp capacitor, high-voltage defibrillation capacitor, flexible capacitor, etc.
Motorcycle ECU, CDI, automobile ECU, various sensors of automobile.
Application of spherical silica powder in EMC industry
The epoxy resin plastic packaging material filled with spherical silicon powder has low thermal conductivity and expansion coefficient, and the filling rate for microelectronic component substrate and packaging can reach 90%. It can be used as an ideal substrate material and packaging material for large-scale and ultra-large-scale integrated circuits.
Spherical silica powder and resin are stirred to form a uniform film, with small amount of resin added and good fluidity. The high weight ratio of filled spherical silica powder can reach 90.5%, so electronic components with good performance can be produced.
Spherical plastic packaging material has low stress concentration and high strength. Therefore, when packaging integrated circuit chips, spherical powder plastic packaging material has high yield and is not easy to produce mechanical damage during transportation, installation and use.
The spherical powder has small friction coefficient and small wear on the mold, which can double the service life of the mold and reduce the cost.